G. J. Fokken

VCSEL electrical packaging analysis and design guidelines for multi-GHz applications

Barry K. Gilbert, W. L. Walters, S. H. Hall, 1997 .

Advanced multichip module packaging and interconnect issues for GaAs signal processors operating abo

Herbert H. Thompson, Steffen Zahn, G. J. Fokken, 1990 .

A chips-first multichip module implementation of passive and active test coupons utilizing Texas Instruments' high density interconnect technology

Barry K. Gilbert, D. J. Schwab, B. A. Randall, 1996 .

FAST-Net optical interconnection prototype characterization

Predrag Milojkovic, M. Vickberg, Yue Liu, 1999 .

Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers

Barry K. Gilbert, W. L. Walters, L. F. Mattson, 2000 .