Y. Ousten

发表

Y. Ousten, Xavier Chapeleau, 2007 .

Y. Ousten, Y. Deshayes, L. Bechou, 2010, IEEE Transactions on Device and Materials Reliability.

Y. Ousten, D. Lewis, V. Pouget, 2005, IEEE Transactions on Device and Materials Reliability.

Y. Ousten, L. Bechou, J. Mazeau, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Y. Ousten, D. Lewis, V. Pouget, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Y. Ousten, R. Baillot, Y. Deshayes, 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.

Y. Ousten, Y. Deshayes, D. Laffitte, 2008, IEEE Transactions on Components and Packaging Technologies.

Y. Danto, Y. Ousten, L. Bechou, 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).

Y. Danto, Y. Ousten, L. Bechou, 1997, Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Y. Danto, Y. Ousten, H. Fremont, 1990, 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.

S. Jacques, Y. Ousten, L. Bechou, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Y. Ousten, M. Vanzi, O. Gilard, 2008, 2008 IEEE Radiation Effects Data Workshop.