W. Chow

Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)

J. Lau, J. Lam, J. Lo, 2007, Electronic Packaging Technology Conference.

Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)

J. Lau, J. Lam, J. Lo, 2007, International Conference on Electronic Materials and Packaging.