Ching-Tsung Lin

Creating E-Business Value And Firm Performance From Supply Chain Perspective

Chorng-Shyong Ong, Ching-Tsung Lin, Ching-Tsung Lin, 2011, PACIS.

Influence of underfill materials on the reliability of coreless flip chip package

Yin-Po Hung, Tao-Chih Chang, Yu-Min Lin, 2008, Microelectron. Reliab..

Factors Driving Value Creation in Online B2B Banking

Chorng-Shyong Ong, Ching-Tsung Lin, Jung-Yu Lai, 2013, J. Glob. Inf. Manag..

What factors drive corporate customer satisfaction with e-banking services

Ching-Tsung Lin, Jung-Yu Lai, Jung-Yu Lai, 2008, PACIS.

The impacts of user readiness on perceived value

Chorng-Shyong Ong, Ching-Tsung Lin, Ching-Tsung Lin, 2013, ASIST.

Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards

Ching-Tsung Lin, Tao-Chih Chang, Moo-Chin Wang, 2008 .