H. Lin

Superplastic micro-forming with a fine grained Zn–22Al eutectoid alloy using hot embossing technology

H. T. Lin, C. Chang, M. Yeh, 2006 .

Cyclic Stress-Strain Behavior of BGA (Sn/3.5Ag/0.75Cu) Solder Joint under Cyclically Oblique Displacement Tests and Endochronic Viscoplastic Predictions

C. F. Lee, T. Lin, H. Lin, 2010 .