Denis Dutoit

发表

3D advanced integration technology for heterogeneous systems

Christian Bernard, Fabien Clermidy, Gaël Pillonnet, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Reconfiguration of a 3GPP-LTE telecommunication application on a 22-core NoC-based system-on-chip

Fabien Clermidy, Dimitri Ktenas, Romain Lemaire, 2011, Proceedings of the Fifth ACM/IEEE International Symposium.

3D NoC using through silicon Via: An asynchronous implementation

Fabien Clermidy, Yvain Thonnart, Pascal Vivet, 2011, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip.

EUROSERVER: Energy Efficient Node for European Micro-Servers

Paul M. Carpenter, Iakovos Mavroidis, Angelos Bilas, 2014, 2014 17th Euromicro Conference on Digital System Design.

Platform 2012, a many-core computing accelerator for embedded SoCs: Performance evaluation of visual analytics applications

Luca Benini, Fabien Clermidy, Eric Flamand, 2012, DAC Design Automation Conference 2012.

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters

Christian Bernard, Fabien Clermidy, Alain Greiner, 2020, 2020 IEEE International Solid- State Circuits Conference - (ISSCC).

System-level thermal modeling for 3D circuits: Characterization with a 65nm memory-on-logic circuit

Ricardo Reis, Nicolas Peltier, Pascal Vivet, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

3D integration for power-efficient computing

Ivan Miro Panades, Eric Guthmuller, Denis Dutoit, 2013, 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Dynamic memory device for a mobile phone

Michel Harrand, Denis Dutoit, Francois Druilhe, 2006 .

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Christian Bernard, Fabien Clermidy, Alain Greiner, 2021, IEEE Journal of Solid-State Circuits.

Paving the Way Towards a Highly Energy-Efficient and Highly Integrated Compute Node for the Exascale Revolution: The ExaNoDe Approach

Luca Benini, Paul M. Carpenter, Benoît Dupont de Dinechin, 2017, 2017 Euromicro Conference on Digital System Design (DSD).

EU FP7 INFSO-ICT-247223 ARTIST4G, D6.3 - Laboratory and field trial results connected to the second set of innovations

Dimitri Ktenas, Serdar Sezginer, Yang Liu, 2012 .

Thermal analysis and model identification techniques for a logic + WIDEIO stacked DRAM test chip

Luca Benini, Andrea Bartolini, Francesco Beneventi, 2014, 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE).

3D Embedded multi-core: Some perspectives

Fabien Clermidy, Pascal Vivet, Walid Lafi, 2011, 2011 Design, Automation & Test in Europe.

Memory controllers for high-performance and real-time MPSoCs requirements, architectures, and future trends

Tei-Wei Kuo, Fabien Clermidy, Kees G. W. Goossens, 2011, 2011 Proceedings of the Ninth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS).

3D stacking for multi-core architectures: From WIDEIO to distributed caches

Fabien Clermidy, Ivan Miro Panades, Pascal Vivet, 2013, 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013).

A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC

Christian Bernard, Fabien Clermidy, Yvain Thonnart, 2013, 2013 Symposium on VLSI Technology.

EU FP7 INFSO-ICT-247223 ARTIST4G, D6.1 First feedback on implementation aspects connected to the selected innovations

Dimitri Ktenas, Serdar Sezginer, Wolfgang Zirwas, 2011 .

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Christian Bernard, Yvain Thonnart, Pascal Vivet, 2020, 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE).

A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links

Christian Bernard, Fabien Clermidy, Frédéric Pétrot, 2017, IEEE Journal of Solid-State Circuits.