S. Yeh

发表

IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES

David W. Ihms, S. Yeh, 2007 .

Copper doped eutectic tin-lead bump for power flip chip applications

S. Yeh, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..