Soichi Kuritani

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint

Kimihiro Yamanaka, Kiju Lee, Katsuaki Suganuma, 2011, Microelectron. Reliab..

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints

K. Suganuma, Keun-Soo Kim, Y. Tsukada, 2011 .

Effects of the crystallographic orientation of Sn grain during electromigration test

K. Suganuma, Keun-Soo Kim, Y. Tsukada, 2010, 2010 IEEE CPMT Symposium Japan.

Effects of crystallographic orientation of Sn on electromigration behavior

K. Suganuma, Keun-Soo Kim, Y. Tsukada, 2010 .