V. Kripesh

Electric Current Induced Brittle Failure of Eutectic Lead and Lead-free Solder Joints with Electroless Ni-P Metallization

C. C. Wong, S. Mhaisalkar, Zhong Chen, 2006 .

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Andrew A. O. Tay, Vaidyanathan Kripesh, Lu Shen, 2006 .

A study on microstructural and mechanical properties of nanocrystalline nickel

A. Tay, R. Jayaganthan, K. Mohankumar, 2005 .

Effect of humidity on optical fiber-adhesive bonding

Anand Asundi, Vaidyanathan Kripesh, H. Kaur, 2005, SPIE Optics + Photonics.