Chenming Hu

发表

Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections

C-K. Hu, Chenming Hu, 1995 .

Electromigration in two-level interconnect structures with Al alloy lines and W studs

P. S. Ho, M. B. Small, C-K. Hu, 1992 .

Reaction Kinetics, Stress And Microstructure In Titanium-Copper-Titanium Thin Films

J. Wetzel, P. Ho, D. Gupta, 1985 .

Effect of Hydrogen on Thermal Stress in Layered Structure of Ti and Ti(Al) Thin Films.

P. Ho, D. Gupta, Chenming Hu, 1988 .

Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures

P. Ho, I. Yeo, S. Anderson, 1995 .

Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)

Stephan A. Cohen, Anita Madan, C-K. Hu, 2012 .

Materials and scaling effects on on-chip interconnect reliability

D. Edelstein, L. Gignac, E. Liniger, 2013 .

Electromigration failure due to interfacial diffusion in fine Al alloy lines

Paul S. Ho, M. B. Small, Kenneth P. Rodbell, 1993 .

Electromigration Drift Velocity in Al‐Alloy and Cu‐Alloy Lines

C-K. Hu, C. Stanis, K. L. Lee, 1996 .

Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

C. Cabral, L. Gignac, I. C. Noyan, 1999 .