A. F. Razzk

Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi

A. El-Taher, A. F. Razzk, 2020, Metals and Materials International.

Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn–3.0Ag–0.7Cu lead-free solder alloy

A. El-Taher, A. Ibrahiem, A. F. Razzk, 2020, Journal of Materials Science: Materials in Electronics.