Jarrett Liang

Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

K. Tu, Luhua Xu, S. Liang, 2009, 2009 59th Electronic Components and Technology Conference.

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Y. Lai, K. Tu, Luhua Xu, 2008 .