K. Shibuya

Reliability studies of Sn-Ag-Cu BGA solder joints on Ni/Cu/Au surface finish for SMAFTI packaging technology

K. Soejima, M. Kawano, M. Kawano, 2008, 2008 58th Electronic Components and Technology Conference.

System in wafer-level package technology with RDL-first process

Tomohiro Nishiyama, Masaya Kawano, Kazuyuki Mineo, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Fan-Out Wafer-Level Packaging with highly flexible design capabilities

Hiroaki Kobayashi, Masaya Kawano, Takehiro Kimura, 2010, 3rd Electronics System Integration Technology Conference ESTC.