J. Jang

发表

Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

D. Frear, L. Ramanathan, J. Jang, 2008 .

Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Soon-Bok Lee, K. Paik, Kyoung-Lim Suk, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

Jae-Won Jang, Kyung-Wook Paik, Soon-Bok Lee, 2009, International Conference on Experimental Mechanics.

Solderability and BGA Joint Reliability of Sn-Ag-Cu-In-(Mn, Pd) Pb-free Solders

Jong-Hyun Lee, Chang-Woo Lee, Jun-Ki Kim, 2013 .

A graphene meta-interface for enhancing the stretchability of brittle oxide layers.

Soon-Bok Lee, Jae‐Hyun Kim, Soon-Gil Yoon, 2016, Nanoscale.

In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique

Soon-Bok Lee, Jin-Hyoung Park, J. Jang, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fracture toughness assessment of ACF flip-chip packages under high moisture condition with moire interferometry

Soon-Bok Lee, K. Paik, Kyung-Woon Jang, 2009, 2009 European Microelectronics and Packaging Conference.

Improved reliability of Sn-Ag-Cu-In solder alloy by the addition of minor elements

Jong-Hyun Lee, Jun-Ki Kim, Mok-Soon Kim, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Thermally induced deformation measurement of through-silicon via (TSV) structures using an atomic force microscope (AFM) moiré method

Jae-Won Jang, Soon-Bok Lee, Soon-Bok Lee, 2012, 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).

Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes

Soon-Bok Lee, Jae‐Hyun Kim, Jae-won Jang, 2014 .

Review: Scaffold Characteristics, Fabrication Methods, and Biomaterials for the Bone Tissue Engineering

Cheolhee Kim, Jae-won Jang, Sung Yi, 2023, International Journal of Precision Engineering and Manufacturing.

The PTCR Characteristics of the Laminated SMD-Type PTC Thermistor as a Function of the Heat Treatment Conditions

Tae-Young Lim, Mi-Jai Lee, Jun-Baek Song, 2012 .

Ultrasonic Attenuation Characteristics of Glass-Fiber-Reinforced Polymer Hull Structure

Jae-won Jang, J. Woo, Zhiqiang Han, 2021, Applied Sciences.

Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test

Soon-Bok Lee, Nam-Seog Kim, J. Jang, 2012 .

Statistical Characteristics of Fatigue Failure of Copper Thin Films

Soon-Bok Lee, Jae‐Hyun Kim, Jae-won Jang, 2013 .

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Jong-Kai Lin, D. R. Frear, Jin-Wook Jang, 2005 .

Catalysts characteristics of Ni/YSZ core-shell according to plating conditions using electroless plating

Jin-ho Kim, Jonghwan Lee, D. Jeon, 2017, Metals and Materials International.

Prediction of Curing Time/Shear Strength of Non-Conductive Adhesives Using a Neural Network Model

Cheolhee Kim, Jun-Ki Kim, K. Min, 2022, Applied Sciences.