Z. Xiong

Eutectic Sn/Pb solder bump cracking issue of large-die flip chip ball grid array (FCBGA) package with electroless Ni/immersion au (ENIG) build-up substrate

K. H. Chua, J. Osenbach, Z. Xiong, 2006, 2006 8th Electronics Packaging Technology Conference.

Degradation of Pb/Sn solder balls on electrolytic Ni/Au substrates as a result of post assembly heat treatments

K. H. Chua, J. Osenbach, L. Tok, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad

K. H. Chua, Z.P. Xiong, Ho Pei Sze, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-die Flip Chip Ball Grid Array (FCBGA) Package

K. H. Chua, P. Ho, Z. Xiong, 2007, 2007 9th Electronics Packaging Technology Conference.

Failure analysis of full delamination on the stacked die leaded packages

K. H. Chua, Y. Yao, T.Y. Lin, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..