A. Ostmann

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

H. Reichl, K. Paik, Young-Doo Jeon, 2005 .

Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

H. Reichl, K. Paik, Young-Doo Jeon, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

H. Reichl, Sabine Nieland, Young-Doo Jeon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Andreas Ostmann, H. Reichl, Elke Zakel, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Chip-in-polymer: volumetric packaging solution using PCB technology

C. Landesberger, Andreas Ostmann, Herbert Reichl, 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.