P. Byrne

Degradation of electroless Ni(P) under-bump metallization in Sn3.5Ag and Sn37Pb solders during high-temperature storage

P. Cheasty, G. Duffy, J. Rohan, 2004 .

Packaging and integration technologies for future high-frequency power supplies

Maeve Duffy, Weimin Chen, Terence O'Donnell, 2004, IEEE Transactions on Industrial Electronics.