Hui-Hui Yuwen

The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array

H. Qin, Xin-Ping Zhang, M. Zhou, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via structure

H. Qin, Xin-Ping Zhang, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Knowledge Modeling Based on Ontology for Disaster Warning Information Release Technology of Urban Industrial Disaster

Xueqiu He, Mengqi Yuan, Xinmin Qian, 2016, 2016 International Conference on Network and Information Systems for Computers (ICNISC).