H.T. Ma

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

N. Zhao, Y. Zhong, M. Huang, 2015, Scientific Reports.

Analysis and control of Cu6Sn5 preferred nucleation on single crystal (0 0 1)Cu

C. Dong, N. Zhao, J. Chen, 2020, Materials Letters.

In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient

Haoran Ma, N. Zhao, Y. Zhong, 2018, Materials Chemistry and Physics.

The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows

N. Zhao, J. Chen, S. Li, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).