P. Lee

Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) reactive system: P content effects

Cheng-En Ho, T. T. Kuo, Y. H. Huang, 2018, Surface and Coatings Technology.

Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification

C.E. Ho, T. T. Kuo, Y. Huang, 2019, Corrosion Science.

High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

Chih‐Hao Chang, Cheng-Yu Lee, Cheng-En Ho, 2021 .

Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5

C. Ku, C. Kao, Cheng-Yu Lee, 2021, Journal of Materials Research and Technology.

A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn

C. Kao, Chin-Hao Tsai, Pei-Tzu Lee, 2021 .