H. Gunther
发表
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.
On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound
M. Stecher,
A. Kessler,
R. Tilgner,
2009,
IEEE Transactions on Device and Materials Reliability.
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.