Chun-Yu Lee

Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications

Yu-Lin Kuo, Y. Yen, Chiapyng Lee, 2007 .

Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag–Cu alloy fillers in a solid oxide fuel cell system

Y. Yen, Jiangang Su, Don-Ping Huang, 2008 .

Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate

Y. Yen, Kuen-da Chen, Chun-Yu Lee, 2009 .

ACF particle distribution in COG process

Chun-Yu Lee, Yee-Wen Yen, Y. Yen, 2011, Microelectron. Reliab..