Ching-Yang Chen

Procedure for design optimization of a T-cap flip chip package

De-Shin Liu, Chin-Yu Ni, Ching-Yang Chen, 2002, Microelectron. Reliab..

Integrated design method for flip chip CSP with electrical, thermal and thermo-mechanical qualifications

De-Shin Liu, Chin-Yu Ni, Ching-Yang Chen, 2003 .

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method

De-Shin Liu, Zhen-Wei Zhuang, Ching-Yang Chen, 2010, Microelectron. Reliab..

A thermomechanical study of the electrical resistance of Cu lead interconnections

De-Shin Liu, Y. Chao, Ching-Yang Chen, 2006 .