K. Rivera
发表
K. Sikka,
S. Li,
H. Liu,
2014,
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
E. Beyne,
M. Baelmans,
V. Cherman,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
E. Beyne,
M. Baelmans,
V. Cherman,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.