D. Mullen

Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring

Xi Liu, Ming Li, Donald R. Mullen, 2014, IEEE Transactions on Device and Materials Reliability.

Measurement and characterization of backplanes for serial links operating at 56 Gbps

Wendemagegnehu T. Beyene, Yeon-Chang Hahm, Dave Secker, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).