Kazuhiko Kurafuchi
发表
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
T. Terasaki,
M. Nishimura,
Tomohisa Suzuki,
2016,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Masuko,
Masaya Toba,
Kazuyuki Mitsukura,
2018,
International Symposium on Microelectronics.
T. Masuko,
Masaya Toba,
Kazuyuki Mitsukura,
2020
.
T. Masuko,
Masaya Toba,
Kazuyuki Mitsukura,
2019,
International Symposium on Microelectronics.
Masaya Toba,
Tomonori Minegishi,
Kazuyuki Mitsukura,
2017
.
Y. Ejiri,
Masaya Toba,
Tomonori Minegishi,
2016
.