K. N. Chen

Silicide formation in implanted channels and interfacial reactions of metal contacts under high current density

L. J. Chen, K. Tu, J. Huang, 1999 .

Temperature and duration effects on microstructure evolution during copper wafer bonding

Kuan-Neng Chen, A. Fan, C. S. Tan, 2003 .

Bonding parameters of blanket copper wafer bonding

Kuan-Neng Chen, A. Fan, C. S. Tan, 2006 .

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

Bonding temperature optimization and property evolution of SU-8 material in metal/adhesive hybrid wafer bonding.

C. Ko, K N Chen, C A Cheng, 2011, Journal of nanoscience and nanotechnology.

Electrical characterization and reliability investigations of Cu TSVs with wafer-level Cu/Sn-BCB hybrid bonding

W. C. Lo, Y. H. Chen, K. N. Chen, 2012, Proceedings of Technical Program of 2012 VLSI Technology, System and Application.

Interfacial morphologies and possible mechanisms of copper wafer bonding

K. N. Chen, A. Fan, R. Reif, 2002 .