Han-Hui Tsai

A study of cyclic bending reliability of bare-die-type chip-scale packages

Yi-Shao Lai, Tong Hong Wang, Jenq-Dah Wu, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Mechanical property testing of irradiated Zircaloy cladding under reactor transient conditions

Saurin Majumdar, Michael C. Billone, Arthur T. Motta, 2001 .