M. Abo Ras
发表
B. Wunderle,
D. May,
H. Oppermann,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
A. Ziaei,
B. Wunderle,
D. May,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
R. Schacht,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
J. Heilmann,
2022,
Microelectronics Reliability.
S. Rzepka,
P. Lurkens,
E. Merten,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
N. Meyendorf,
D. May,
I. Hakim,
2016,
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.