Sukshitha Achar Puttur Lakshminarayana

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

C. Handwerker, G. Subbarayan, J. Blendell, 2021, Journal of Electronic Materials.