Y. Kim

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

K.-S. Choi, S. Lee, Xiaowu Zhang, 2002 .

Thermocompression bonding effects on bump-pad adhesion

Ilene J. Busch‐Vishniac, Glenn Y. Masada, G. Y. Masada, 1995 .

The Influence of Welding Conditions on Mechanical Properties and Microstructural Change of TIG Welded Joint in Extruded Plate AZ31B Mg Alloy

D. Chung, Y. Kim, S. Lee, 2007 .

A concave-patterned TiN/PECVD-Si3N4 /TiN diaphragm MEMS acoustic sensor based on a polyimide sacrificial layer

Y. G. Kim, S. Q. Lee, Sang-Gug Lee, 2015 .