Tsung-yuan Chen

DESIGN AND MANUFACTURING OF MICRO VIA-IN-PAD SUBSTRATES FOR SOLDER BUMPED FLIP CHIP APPLICATIONS

J. Lau, Chris Chang, D. Lin, 2000 .

DESIGN, MANUFACTURING, AND TESTING OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE

J. Lau, Chris Chang, Tony Chen, 1999 .