M. M. Salleh

Properties of Sn-3wt%Ag-5wt%Cu alloys with CuSn intermetallics grain refined by Mg

K. Nogita, H. Yasuda, N. Saud, 2022, Materials Today Communications.

Solder microstructure and intermetallic interface evaluation between Sn-3.5Ag-1.0Cu-xNi lead free solder under long time thermal aging (x: 0, 0.05, 0.2, 0.5)

Z. Ahmad, R. Mayappan, N. A. A. Ghani, 2012, 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge

K. Nogita, N. Saud, J. Chaiprapa, 2022, Journal of Materials Research and Technology.

Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)

H. A. Hamid, Z. Ahmad, R. Mayappan, 2012, 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

Recent graphene oxide/TiO2 thin film based on self-cleaning application

V. Chobpattana, N. Mahmed, A. Azani, 2019, IOP Conference Series: Materials Science and Engineering.

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

K. Nogita, M. Aziz, M. Ramli, 2022, Journal of Materials Science: Materials in Electronics.

Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging

K. Nogita, M. Ramli, N. S. M. Zaimi, 2022, JOM.