Changchang Wang

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Yue Gao, Zhi-Quan Liu, Zhaoqing Gao, 2021, Journal of Materials Science: Materials in Electronics.

Study on UV-LIGA Technology Fabrication of Micro Gear Transmission Device

Ming Lu, Yuan Guo Zhang, Zhong Ming Liu, 2011 .

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Zhi-Quan Liu, Yinbo Chen, Changchang Wang, 2020, Acta Metallurgica Sinica (English Letters).

Temperature field and thermal effects of the longitudinal connected slab track based on the measurement data and thermal-fluid-structure coupling analysis

Xiaopei Cai, Yanglong Zhong, Zelin Chen, 2022, Construction and Building Materials.