G. Heaslip

A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

B. Rodgers, J. Punch, M. Reid, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Board Level Drop Tests Comparing Lead-Free and Eutectic Solder Interconnects on a BGA Package for Mobile ICT Applications

Jeff Punch, Greg Heaslip, Bryan Rodgers, 2004 .