Q. Han

Design and optimization of thermo-mechanical reliability in wafer level packaging

Q. Han, X. J. Fan, B. Varia, 2010, Microelectron. Reliab..

Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages

Xuejun Fan, Xuejun Fan, Qiang Han, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

A Method for Composite Wing Box Optimization with Manufacturing Constraints

X. P. Zhong, P. Jin, Q. Han, 2015 .

Design and Reliability in Wafer Level Packaging

Xuejun Fan, Xuejun Fan, Qiang Han, 2008, 2008 10th Electronics Packaging Technology Conference.