E. Sohn

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Kim, 2005, IEEE Transactions on Electronics Packaging Manufacturing.

Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

A. Syed, Tae Seong Kim, W. Kang, 2008, 2008 58th Electronic Components and Technology Conference.

A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design

Choonheung Lee, M. W. Lee, Joon-Yeob Lee, 2008, 2008 58th Electronic Components and Technology Conference.

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

Jin-Young Kim, Tae-Kyung Hwang, Joon-Yeob Lee, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.