Geng Li

Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling

Yanhong Tian, Jiayun Feng, Tao Wang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Yanhong Tian, Jiayun Feng, Wenyu Wu, 2023, Coatings.

Nano-Cavities within Nano-Zeolites: The Influencing Factors of the Fabricating Process on Their Catalytic Activities

Yunan Wang, Jingui Wang, Tianduo Li, 2023, Nanomaterials.