T. Yang

Interfacial microstructures and mechanical properties of molten Sn reacting with Ni–xP films

C.E. Ho, T. T. Kuo, M. A. Rahman, 2016 .

Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars

C. Kao, Y. Chiu, H. Yu, 2019, Journal of Electronic Materials.

Proposal of bond criterion for hot roll bonding and its application

S. Castagne, Xinping Zhang, C. Gu, 2011 .

Entrance analysis of 7075 Al/Mg–Gd–Y–Zr/7075 Al laminated composite prepared by hot rolling and its mechanical properties

S. Castagne, Xinping Zhang, C. Gu, 2011 .

Bonding strength of Al/Mg/Al alloy tri-metallic laminates fabricated by hot rolling

M. Tan, X. Zhang, X. J. Xu, 2011 .

Microstructure; bonding strength and thickness ratio of Al/Mg/Al alloy laminated composites prepared by hot rolling

Sylvie Castagne, T. H. Yang, S. Castagne, 2011 .

Diamond cutting tools with a Ni3Al matrix processed by reaction pseudo-hipping

K. Hwang, S. Hu, T. H. Yang, 2005 .