Zol Effendi Zolkefli

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

A. Jalar, M. A. Bakar, A. Ehsan, 2022, Scientific Reports.

Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA

A. Jalar, F. C. Ani, M. A. Bakar, 2022, 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).