M. Gage

Cobalt fill for advanced interconnects

Mehul Naik, Nikolaos Bekiaris, He Ren, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

Takayuki Ohba, S. W. Kim, Hideki Kitada, 2012 .

Resistance Scaling of Cu Interconnect and Alternate Metal (Co, Ru) Benchmark toward sub 10nm Dimension

J. Tseng, M. Naik, He Ren, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).