D. Bertheau

Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment

Denis Bertheau, X. Milhet, D. Mellier, 2015, Journal of Electronic Materials.

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density

Denis Bertheau, X. Milhet, Vincenzo Caccuri, 2014, Journal of Electronic Materials.