J. Lane

The role of feedgas chemistry, mask material, and processing parameters in profile evolution during plasma etching of Si(100)

F. Klemens, K. Bogart, J. T. Lee, 2000 .

Mask charging and profile evolution during chlorine plasma etching of silicon

M. V. Malyshev, V. M. Donnelly, F. Klemens, 2000 .

Feature evolution during plasma etching. II. Polycrystalline silicon etching

M. V. Malyshev, Fred P. Klemens, J. T. C. Lee, 2000 .

Mapping of wafer profile to plasma processing conditions: Forward and reverse maps

E. Rietman, J. T. Lee, N. Layadi, 2000 .