X. Wu

Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn–Zn–Ag/6061Al joints in antenna module packages

Tao Sun, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste

Min-bo Zhou, Xin-Ping Zhang, M. Zhou, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment

C. Ke, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

A Three-Dimensional Printable Liquid Metal-Like Ag Nanoparticle Ink for Making a Super-Stretchable and Highly Cyclic Durable Strain Sensor.

X. Ning, Min-bo Zhou, Tao Sun, 2021, ACS applied materials & interfaces.