Yuan-Jiang Lin

Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures

Xin-Ping Zhang, X. Ma, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Transfer modeling of 1T1R crossbar arrays with line resistances based on matrix algebra method

Y. Zeng, Yuan-Jiang Lin, Xin Zhang, 2021, Solid-State Electronics.