Wai Yin Hnin

150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects

V. Kripesh, Seung Wook Yoon, A.G.K. Viswanath, 2008, IEEE Transactions on Advanced Packaging.

Design of a bidirectional WDM module for multi-channel transceivers

Jing Li, Teck Guan Lim, Jing Zhang, 2007, SPIE/OSA/IEEE Asia Communications and Photonics.

Process Development and Reliability of Microbumps

Vempati Srinivasa Rao, Vaidyanathan Kripesh, Andy Fenner, 2010, IEEE Transactions on Components and Packaging Technologies.

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

John H. Lau, Nandar Su, Vaidyanathan Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

A. Kumar, D. Pinjala, J. H. Lau, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Assembly challenges of high density large fine pitch lead-free flip chip package

Yeow Meng Tan, Tai Chong Chai, Wai Yin Hnin, 2006, 56th Electronic Components and Technology Conference 2006.

Surface mountable low cost packaging for RFID device

S.Y.L. Lim, Wai Yin Hnin, Ser Choong Chong, 2006, 2006 8th Electronics Packaging Technology Conference.