Y. Y. Tan

Growth kinetics of individual Al-Cu intermetallic compounds

Rui Huang, R. Resel, R. Bauer, 2014, IEEE International Interconnect Technology Conference.

Early whisker detection through intermetallic compound (IMC) grain size

Y. Y. Tan, D. On, J. Krishnan, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Simulation of diffusion controlled intermetallic formation of Au/Al interface

Rui Huang, Xuejun Fan, H. Pape, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Effect of Cu and PdCu wire bonding on bond pad splash

K. S. Sim, Y. Y. Tan, 2014 .

Line Profile Measurement for SEM Imaging System

Kok-Swee Sim, Yik Yee Tan, Shyamala Pillay, 2006, IPCV.