I. C. Ume

发表

Warpage measurement comparison using shadow Moire and projection Moire methods

Hai Ding, R. E. Powell, C. R. Hanna, 2002 .

Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm

Wei Tan, I. C. Ume, 2008 .

Defects pattern recognition for flip chip solder joint quality inspection with laser ultrasound and interferometer

Sheng Liu, I. C. Ume, Sheng Liu, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Graduate mechatronics course: final group projects

Bao Mi, I. C. Ume, Akio Kita, 2003, Proceedings 2003 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM 2003).

A relative comparison of PWB warpage due to simulated infrared and wave soldering processes

Y. Polsky, I. C. Ume, W. Sutherlin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Warpage measurement system with systematic error analysis

Yu Qiu, Yilan Kang, Hai Ding, 2003, Other Conferences.

Finite element analysis of PWB warpage due to the solder masking process

I. C. Ume, T. Martin, J. T. Gatro, 1997 .

Automated system for laser ultrasonic sensing of weld penetration

I. C. Ume, G. M. Graham, 1997, Proceedings of IEEE/ASME International Conference on Advanced Intelligent Mechatronics.

Warpage studies of HDI test vehicles during various thermal profilings

I. C. Ume, G. J. Petriccione, G. Petriccione, 1999 .

A finite element modeling methodology for thermomechanical analysis of printed wiring board assemblies

Hai Ding, R. E. Powell, C. R. Hanna, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Revolutionalising engineering programmes in developing countries by incorporating a mechatronics curriculum

E. Chikuni, O. I. Okoro, I. C. Ume, 2011, IEEE Africon '11.

Development of mechatronics course in the School of Mechanical Engineering at Georgia Tech

A. Kita, I. C. Ume, C. F. Bergh, 1999, 1999 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (Cat. No.99TH8399).

Warpage studies of HDI test vehicles during various thermal profiling

I. C. Ume, G. J. Petriccione, G. Petriccione, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection System

I. C. Ume, Jin Yang, Lizheng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Prediction and experimental validation of penetration depth of butt welds in thin plates using superimposed laser sources

I. C. Ume, Tsun-Yen Wu, I. Ume, 2012 .

Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA Packages

I. C. Ume, Sungbum Kang, I. Ume, 2014 .

A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

David L. McDowell, I. C. Ume, D. McDowell, 1998 .

Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

I. C. Ume, I.C. Ume, Lizheng Zhang, 2009, IEEE Transactions on Components and Packaging Technologies.

Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

I. C. Ume, Lizheng Zhang, J. Gamalski, 2009, Proceedings Electronic Components and Technology, 2005. ECTC '05..

A comparison of PWB warpage due to simulated infrared and wave soldering processes

Y. Polsky, I. C. Ume, W. Sutherlin, 2000 .

Warpage measurement of large area multitilted silicon substrates at various processing conditions

I. C. Ume, Anh X. H. Dang, S. K. Bhattacharya, 2000 .

Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method

I. C. Ume, Jin Yang, 2009 .

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Yarom Polsky, I. C. Ume, Y. Polsky, 1999 .

Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis

I. C. Ume, T. Martin, T. Martin, 1997 .

A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system

Sheng Liu, I. C. Ume, Achyuta Achari, 2001 .

Online-offline laser ultrasonic quality inspection tool for multi-layer chip capacitors

I. C. Ume, D. S. Erdahl, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Measuring on-line and off-line noncontact ultrasound time of flight weld penetration depth

I. C. Ume, Akio Kita, 2007 .

Characterization of in-process substrate warpage of underfilled flip chip assembly

I. C. Ume, D. Baldwin, Jian Zhang, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

In-process stress characterization of flip chip assembly on warped organic substrate

I. C. Ume, D. Baldwin, Jian Zhang, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

I. C. Ume, M. R. Stiteler, 1997 .

Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process

Wei Tan, I. C. Ume, W. Tan, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies

I. C. Ume, C. F. J. Wu, W. Tan, 2008, IEEE Transactions on Advanced Packaging.

Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging

I. C. Ume, Anh X. Dang, S. Bhattacharya, 2000 .

Inspection of the residual stress on welds using laser ultrasonic supported with finite element analysis

I. C. Ume, Vishnu V. B. Reddy, Chong Ye, 2019, Manufacturing Review.

Welding induced residual stress evaluation using laser-generated Rayleigh waves

I. C. Ume, Vishnu V. B. Reddy, Chong Ye, 2018 .

Integrated hardware and software for improved flatness measurement: ATC4.1 flip chip assembly case studies

R. E. Powell, I. C. Ume, D. Baldwin, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

Experimental and Numerical Study of the Effect of Plastic Ball Grid Array Package Placement on PWB Warpage During Convective Solder Reflow

R. E. Powell, I. C. Ume, W. Tan, 2006 .

Frequency spectrum analysis of laser generated ultrasonic waves in ablative regime

I. C. Ume, Bao Mi, I. Ume, 2002 .

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

I. Charles Ume, I. C. Ume, Jie Gong, 2010 .

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

I. Charles Ume, R. E. Powell, I. C. Ume, 2009 .

Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

I. Charles Ume, I. C. Ume, Jie Gong, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

I. C. Ume, Lizheng Zhang, J. Gamalski, 2009, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Development of a flexible laser ultrasonic probe

I. Charles Ume, I. C. Ume, Sandra Nowland Hopko, 2002 .

Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards

I. C. Ume, Sungbum Kang, 2018, The International Journal of Advanced Manufacturing Technology.

Three-dimensional ray tracing of laser ultrasound for weld penetration sensing

I. Charles Ume, I. C. Ume, Bao Mi, 2004 .

Warpage measurement comparison using shadow moire and projection moire methods

Hai Ding, R. E. Powell, C. R. Hanna, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

A projection moiré system for measuring warpage with case studies

I. Charles Ume, Hai Ding, R. E. Powell, 2002 .

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

I. Charles Ume, Yarom Polsky, I. C. Ume, 2001 .

Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method

I. C. Ume, Jin Yang, Jin Yang, 2008, IEEE Transactions on Advanced Packaging.

Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

I. C. Ume, Jie Gong, Ifeanyi Charles Ume, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards

I. Charles Ume, Sungbum Kang, I. C. Ume, 2018 .

Techniques for Measuring Warpage of Chip Packages, PWBs, and PWB Assemblies

Sungbum Kang, I. C. Ume, I. Charles Ume, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System

Jie Gong, I. Charles Ume, Sungbum Kang, 2011 .

Development of Warpage Measurement System to Simulate Convective Solder Reflow Process

R. E. Powell, I. C. Ume, I.C. Ume, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study

Jian Zhang, I. Charles Ume, Daniel F. Baldwin, 2005, IEEE Transactions on Instrumentation and Measurement.

Parametric study of warpage in printed wiring board assemblies

I.C. Ume, R. E. Powell, C. R. Hanna, 2005, IEEE Transactions on Components and Packaging Technologies.

Parametric study of warpage of PWB assemblies and PWB assembly warpage minimization by component layout optimization

I.C. Ume, Hai Ding, I. C. Ume, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Process induced warpage in multitiled alumina substrates for large area MCM-D processing

I. C. Ume, Anh X. Dang, S. Bhattacharya, 2000 .

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

I. Charles Ume, Swapan K. Bhattacharya, I. C. Ume, 2000 .

Warpage of conductive gallium alloy via-filled stainless steel substrates for large area microelectronic packaging

I. C. Ume, D. Baldwin, S. Bhattacharya, 2000 .

Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors - part II

I.C. Ume, I. C. Ume, D.S. Erdahl, 2004, IEEE Transactions on Advanced Packaging.

Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors-Part I

I. C. Ume, I.C. Ume, D.S. Erdahl, 2004, IEEE Transactions on Advanced Packaging.

Inspection of simulated weld penetration depth using laser-generated Lamb waves and wavelet signal processing

Lei Yang, I. Charles Ume, I. C. Ume, 2015 .

Simultaneous Measurement of PWB and Chip Package Warpage Using Automatic Image Segmentation

I.C. Ume, R. E. Powell, I. C. Ume, 2007, IEEE Transactions on Components and Packaging Technologies.

Development of automated real-time data acquisition system for robotic weld quality monitoring

I. Charles Ume, Matthew P. Miller, Bao Mi, 2002 .

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

I. Charles Ume, Sungbum Kang, I. C. Ume, 2013 .

Laser generated ultrasound by material ablation using fiber optic delivery

I. Charles Ume, I. C. Ume, Sandra Nowland Hopko, 1999 .

Structural Modal Analysis for Detecting Open Solder Bumps on Flip Chips

I.C. Ume, I. C. Ume, D.S. Erdahl, 2008, IEEE Transactions on Advanced Packaging.

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Sheng Liu, I. Charles Ume, I. C. Ume, 2002 .

Inspection of notch depths in thin structures using transmission coefficients of laser-generated Lamb waves.

I. C. Ume, Lei Yang, Lei Yang, 2015, Ultrasonics.

Effects of Broadband Laser Generated Ultrasound on Array Gain

I. C. Ume, A. Kita, 2006 .

Laser Ultrasonics: Simultaneous Generation by Means of Thermoelastic Expansion and Material Ablation

I. Charles Ume, I. C. Ume, Sandra Nowland Hopko, 1999 .

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

I. Charles Ume, I. C. Ume, Jin Yang, 2008 .