M. O'Brien

Importance of Overcoming MOVPE Surface Evolution Instabilities for >1.3 μm Metamorphic Lasers on GaAs

B. Corbett, J. O'Callaghan, A. Gocalinska, 2021, 2103.08267.

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration

Wei Wang, David Grant, M. O'Brien, 2009, 2009 IEEE International Conference on 3D System Integration.