J. E. Chung

Submicron and Nanometer Structures Technology and Research

L. T. Su, Henry I. Smith, R. C. Fleming, 1991 .

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

D. Boning, V. Saxena, W. Easter, 2002 .

Simulating the impact of poly-CD wafer-level and die-level variation on circuit performance

Duane S. Boning, D. J. Ciplickas, B. E. Stine, 1997, 1997 2nd International Workshop on Statistical Metrology.

Key issues in evaluating hot-carrier reliability

J. E. Chung, J. E. Chung, 1996, Advanced Lithography.

Statistical metrology: understanding spatial variation in semiconductor manufacturing

Duane S. Boning, J. E. Chung, D. Boning, 1996, Advanced Lithography.